Staff / Principal Engineer

Thin Film Electronics ASA (Ticker: THIN.OL) delivers electronics for ultra-high-volume, cost-sensitive applications. We use roll-to-roll printing to manufacture electronics, introducing intelligence where it has never before been possible—at a cost-per-function unmatched by any other electronic technology.

In this position you will be responsible for the integration and manufacturing qualification of platform and custom technology elements that constitute our ground-breaking printed electronics technology portfolio. You will be a key technology interface to the manufacturing, design and product engineering/management organizations, generating and delivering all aspects of process/device technology performance requirements. This person will own technology development through reliability qualification and documented handoff to manufacturing.


  • Lead process integration with multiple cross functional teams (process, print, ink engineers) delivering novel printed technology modules
  • Responsible for roll-to-roll technology qualification process from concept to manufacturing.
  • Drive technology development methodology with requirements, DOEs, measurements, root cause understanding and electrical/physical failure analysis.
  • Work with multiple organizations on technology roadmap elements for cost reduction and value addition.
  • Device and parametric electrical test generation and data analysis to support yield and product goals.



  • 7+ years of hands on experience in process integration, device engineering, and ownership in a leading edge technology development organization.
  • Deep understanding of transistor design (e.g.  advanced silicon logic nodes, high performance Thin Film Transistors )
  • Strong experience with fundamentals of taking new or unconventional materials and processes to manufacturing.
  • Excellent knowledge of semiconductor process, device, and materials interactions and considerations.
  • Experience with SPICE modeling, EDRs, device physics, JMP (or similar SW), DOEs, and design rules a plus.
  • Prior experience in RFID, printed electronics, and/or roll to roll processing is preferred.
  • Demonstrated ability to learn and adapt to new fields quickly in a hands-on fast-paced environment delivering complex technology solutions.
  • Leading contributor to patent and innovation portfolio.
  • Excellent written and verbal communications skills.
  • Experience with thin film transistors, printed electronics, and sensors is preferred.
  • Experience with design of experiments.
  • MS (Ph.D preferred) degree in Electrical Engineering  or Materials/Chemical Engineering.


To apply, please click here.